TLW 739 - Lastwechselprüfstand für Module
- Thermal long-term investigations into the behaviour of diodes, IGBT and MOSFET modules
- Lifecycle testing in design and quality control applications
- Investigation of the Rth changes during lifecycle testing
- Quality control of bond- and solder processes
- Product qualification according to AQG 324
- Load current generation up to 1,100 A / 18 V
- On-times from 0,5 to 300 s
- 3 measuring current sources up to max. 200 mA (opt. 3,000 mA)
- 18 measurement channels for temperature diodes with up to 2 mA measurement current (with thermocouples type “K”)
- Automatic recording of DUT temperature characteristics
- Temperature measurement on 18 test stations and at 6 temperature chains
- Control for automatic execution of endurance tests and data recording
- Integrated network interface for accessing test results remotely
- Rack mounted industrial PC for data storage and analyses
- Safety overload monitoring and cut off
Merkmale
The TLW 739 has been designed to verify the life cycle characteristics of up to 18 power semiconductor devices (IGBT, MOSFET, Thyristor and diode).
Testing is implemented with forward load current pulses that cause temperature changes and variations in the temperature gradient within the DUT.
With long term life cycle testing “fatigue” alterations of the DUT that influence the forward voltage drop, internal thermal resistance and gate controllability can be monitored and recorded. Any resulting damage of the solder or bonding connections can also be identified.
An external heat exchange unit provides DUT heating and cooling fully interfaced with the test systems control software.
Test result data is saved to the rack mounted PC and can be exported for further analysis.