TLW 763 - Lastwechselprüfstand
- Lifecycle testing in design and quality control applications.
- Investigation of the Rth changes during lifecycle testing.
- For research applications into the behavioural characteristics during development and in design verification.
- Quality control of bond- and solder processes.
- Product qualification according to AQG 324
- Load current generation up to 400 A, optional to 1000 A / 30 V
- On-times from 0.5 to 300 s
- Load cycles at 3 chains
- Measurement current source 200 mA (optional 3000 mA)
- Temperature measurement of 18 specimens with thermocouples type “K”
- Junction temperature measurements via the PN- voltage drop (for MOSFET via inverse diode), suitable for IGBT, SI-MOSFET, SIC-MOSFET, DIODES, and THYRISTORS.
- Automated junction temperature calibration procedure available
- Function test and measurement of the thermal impedance at each cycle
- Rack mounted industrial PC for data storage and analyses
- Safety overload monitoring and cut off
Merkmale
The TLW 763 has been designed to verify the characteristics of power IGBT, MOSFET and diode modules used in power electronics during long term life cycle testing.
Testing is implemented with forward load current pulses that cause temperature changes and variations in the temperature gradient within the DUT.
With long term life cycle testing “fatigue” alterations of the DUT that influence the forward voltage drop, internal thermal resistance and gate controllability can be monitored and recorded. Any resulting damage of the solder or bonding connections can also be identified.
An external heat exchange unit provides DUT heating and cooling fully interfaced with the test systems control software.
Test result data is saved to the rack mounted PC and can be exported for further analysis.