The TLW 800 test system is used to observe the behavior of IGBT modules, diodes, and MOSFET modules for variable loads and the junction temperature of the components in a long-term test.
In this test, a high forward current is alternately switched on and off, causing high periodic changes in the temperature and temperature gradient of the test subject.
Such prolonged overloads can lead to changes in the semiconductor, which are manifested in an increase of the forward voltage,
changes in the thermal resistance, and loss of gate controllability (damage to soldered connections, loosening of connections).
Test result data is saved to the rack mounted PC and can be exported for further analysis.
The option of sending emails to a given address sends immediate notifications in the event of measurement interruptions, allowing the operator to act promptly, which in turn reduces the system downtime.