The TLW 820 has been designed to verify the characteristics of power IGBT, MOSFET and diode modules used in power electronics during long term life cycle testing.
Testing is implemented with forward load current pulses that cause temperature changes and variations in the temperature gradient within the DUT.
With long term life cycle testing “fatigue” alterations of the DUT that influence the forward voltage drop, internal thermal resistance and gate controllability can be monitored and recorded. Any resulting damage of the solder or bonding connections can also be identified.
Test result data is saved to the rack mounted PC with integrated programmable logic controller (PLC) via network interface.
The PLC controls the test procedure and records measurement data. If the connection between the PLC and the software on the PC is interrupted during an active test, the data recording on the PLC continues.