The TLW 820 has been designed to verify the characteristics of power IGBT, MOSFET and diode modules used in power electronics during long term life cycle testing.
Testing is implemented with forward load current pulses that cause temperature changes and variations in the temperature gradient within the DUT.
With long term life cycle testing “fatigue” alterations of the DUT that influence the forward voltage drop, internal thermal resistance and gate controllability can be monitored and recorded. Any resulting damage of the solder or bonding connections can also be identified.
Test result data is saved to the rack mounted PC and can be exported for further analysis.
The option of sending emails to a given address sends immediate notifications in the event of measurement interruptions, allowing the operator to act promptly, which in turn reduces the system downtime.